| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic musical instrument, capable of efficiently dissipating heat of a circuit substrate to outside of a musical instrument case, which is safe for burn etc., without spoiling appearance and design of a musical instrument case. <P>SOLUTION: An attachment groove 11 for attaching a music stand member 10 to an upper case 3 is provided, and an aperture 12a is provided corresponding to a heat sink 16 provided on a circuit substrate 13 at a bottom section 12 of the attachment groove 11. Thus, when heat generated at the circuit substrate 13 is dissipated with the heat sink 16, the dissipated heat is released to an upper direction of the upper case 3 through the aperture 12a of the bottom section 12 at the attachment groove 11 of the upper case 3. Consequently, the heat generated in the circuit substrate 13 is efficiently dissipated to outside of the musical instrument case 1, and as the attachment groove 11 for attaching the music stand member 10 is utilized, excellent appearance and design is achieved and it is safe for burn etc. <P>COPYRIGHT: (C)2011,JPO&INPIT |
