| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a compact optical semiconductor device with high reliability whose semiconductor substrate is not broken due to the load of an inspecting probe during inspection of a CSP equipped with a hollow region; an optical semiconductor device easy to perform a direction recognition of a package; an optical pickup device using the same; and an electronic apparatus. <P>SOLUTION: A semiconductor substrate and a glass substrate are bonded by means of an adhesive layer 103 at the peripheral portion of the semiconductor substrate, and a hollow region 105 is formed in the portion surrounded by the semiconductor substrate, the glass substrate and the adhesive layer 103. In the hollow region 105, reinforcing adhesive layers 104 are formed as a buffer part at positions that correspond to respective bumps 106 disposed at equal intervals on the rear surface of the semiconductor substrate. The semiconductor substrate has a strength that withstands the load of the inspecting probe by means of the reinforcing adhesive layers 104. For direction recognition of a package, the buffer part is not disposed in an arrangement place of at least one buffer part 104b close to a corner part of the semiconductor substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT |
