| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive tape for semiconductor wafer surface protection, which is excellently peeled off without using an ultraviolet curing type adhesive tape for surface protection and does not contaminate a semiconductor wafer, even for the thickness of a wafer, a diameter and a surface film state (polyimide, benzocyclobutene, etc.) in which peeling is difficult conventionally, in the process of sticking the adhesive tape for the semiconductor wafer surface protection to the semiconductor wafer, grinding the back surface of the semiconductor wafer and then peeling the adhesive tape. <P>SOLUTION: The adhesive tape for the semiconductor wafer surface protection has an adhesive layer on a base material film, and the adhesive layer is a pressure-sensitive type adhesive. The contact angle to methylene iodide of the surface of the adhesive layer is≥30 degrees and≤60 degrees. The weight average molecular weight of a polymer which is the main component configuring the pressure-sensitive type adhesive or the weight average molecular weight of a molecule after crosslinking is≥1,000,000. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
