发明名称 SUBSTRATE TAKING-OUT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate taking-out device for taking out a glass substrate, while smoothly removing an interleaf. SOLUTION: This substrate taking-out device 100 includes a placing pat 101 for placing a laminated body 120 of alternately laminating the substrate 112 and the interleaf 114 in an obliquely inclined state to the horizontal. An interleaf receiver 102 is arranged on the lower side of the placing part 101. The substrate taking-out device 100 also includes an interleaf separating machine 103 for shifting an interleaf 114a of the uppermost layer of the laminated body 120 placed on the placing part 101 to the interleaf receiver 102 along an inclination of the laminated body 120 by separating from a substrate 112a of the uppermost layer of the laminated body 120, and a substrate taking-out machine 104 for taking out the substrate 112a of the uppermost layer of the laminated body 120 placed on the placing part 101. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011126701(A) 申请公布日期 2011.06.30
申请号 JP20090289249 申请日期 2009.12.21
申请人 SHARP CORP 发明人 ESASHI NOBORU
分类号 B65H3/00;B65G49/06;B65H41/00;H01L21/677 主分类号 B65H3/00
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