| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet sufficiently preventing a winding trace from being transferred to an adhesive layer when the adhesive sheet having the adhesive layer formed into a prescribed plane shape by precut processing or the like, and capable of sufficiently preventing the formation of voids by rolled-in air when pasting the adhesive layer on an adherend, to provide a method for producing a semiconductor device by using the adhesive sheet; and to provide the semiconductor device. SOLUTION: The adhesive sheet has a separable base material, the adhesive layers dispersedly arranged in the longitudinal direction on the separable base material, and the adhesive films covering the adhesive layers and formed so as to contact with the separable base material at the surroundings of the adhesive layers. Supporting layers having the film thickness equal to or thicker than the total film thickness of the adhesive layer and the adhesive film are intermittently formed between the adhesive films on the separable base material. COPYRIGHT: (C)2011,JPO&INPIT |
