发明名称 ELECTRONIC DEVICE HOUSING
摘要 An electronic device housing is provided. The electronic device housing comprises a substrate, a base paint coating formed on the substrate, and a metallic coating formed on the base paint coating. The metallic coating comprises a plurality of first layers interleaved with a plurality of second layers, and a third layer provided outermost. The first layer and the second layer are respectively a zirconium dioxide layer and an aluminum oxide layer, or are respectively composite component layer of niobium pentoxide and zirconium dioxide, and silicon dioxide layer. The third layer is a magnesium fluoride layer.
申请公布号 US2011159277(A1) 申请公布日期 2011.06.30
申请号 US20100949938 申请日期 2010.11.19
申请人 SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.;FIH (HONG KONG) LIMITED 发明人 CHIANG CHWAN-HWA;DU QI-JIAN
分类号 B32B9/04;B32B18/00;B32B27/06 主分类号 B32B9/04
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