| 摘要 |
A package structure of a light emitting device includes a device substrate, at least a light emitting device, and a cover structure. The cover structure includes a cover substrate, a blocking dam, a sealant and an encapsulation glue. The blocking dam, disposed in a peripheral region of the cover substrate, faces the device substrate and substantially surrounds an active region of the cover substrate. The sealant, disposed in the peripheral region, faces the device substrate and substantially surrounds the blocking dam. The cover substrate and the device substrate are bonded together by virtue of the sealant. The encapsulation glue, blocked by the blocking dam, is substantially disposed in the active region of the cover substrate, and covers at least a part of the light emitting device.
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