<p>Provided are a force sensor and a method of manufacturing the same in which the warping of a substrate due to remnant stress after joining can be reduced and production yield can be improved. A sensor substrate is provided with a plurality of piezo-resistance elements in which the electrical resistance changes in accordance with the amount of displacement of a displacement part when displaced upon receiving a load from the outside through a pressure receiving part. The sensor substrate and a base substrate supporting the sensor substrate are provided with a support part movably supporting the displacement part and a plurality of electrical connector parts electrically connecting to the plurality of the piezo-resistance elements, respectively, such that corresponding support parts are joined to each other and corresponding electrical connector parts are joined to each other. Further, in the sensor substrate and the base substrate, at least either the support part or the plurality of the electrical connector parts is extended to the periphery of the substrate.</p>
申请公布号
WO2011078043(A1)
申请公布日期
2011.06.30
申请号
WO2010JP72615
申请日期
2010.12.16
申请人
ALPS ELECTRIC CO., LTD.;UMETSU, EIJI;ISHIZONE, MASAHIKO;HIRAYAMA, MOTOKI;GOCHOU, HIDEKI