VACUUM CHUCKING SUSCEPTOR AND ATOMIC LAYER DEPOSITION APPARATUS HAVING THE SAME

摘要

PURPOSE: A vacuum chucking susceptor and an atomic layer deposition apparatus having the same are provided to reduce manufacturing costs while preventing the complexity of the device by chucking a plurality of wafers through one vacuum pump. CONSTITUTION: A process chamber(101) provides a space for performing a deposition process. A susceptor(102) is arranged within the process chamber. The Susceptor comprises a base plate(121), a pocket(123), and a chucking part(127). A shower head(103) is arranged in the upper part of the process chamber and supplies a deposition gas to the wafer(10). The deposition supply unit(104) supplies the deposition gas to the shower head.