| 摘要 |
A semiconductor device is protected from static electricity introduced through bump pads and probe test pads. The semiconductor device includes a bump pad through which data is inputted, a first electrostatic discharge unit configured to discharge static electricity introduced through the bump pad, a probe test pad through which data is inputted, the probe test pad having a larger size than the bump pad, a second electrostatic discharge unit configured to discharge static electricity introduced through the probe test pad, and an input buffer unit configured to buffer the data transferred through the bump pad or the probe test pad. |
