APPARATUS FOR APPLYING RESINE TO LED PACKAGE, AND MANUFACTURING METHOD OF LED PACKAGE USING THE APPARATUS

摘要

PURPOSE: An apparatus for applying a resin to an LED package, and a manufacturing method of the led package using the apparatus are provided to easily implement a desired color coordinate by coating a transparent resin including a photo conversion material on the LED chip. CONSTITUTION: In an apparatus for applying a resin to an led package, and a manufacturing method of the LED package using the apparatus, an optical property measurement unit(110) measures the optical property of an LED chip(13) mounted in a package substrate(11). A resin coating unit(150) spreads a transparent resin(50) in the LED chip. The optical property data of the LED chip which is obtained by the optical property measurement unit is transferred to the resin coating unit. A measurement unit(151) calculates suitable coating according to transferred optical property. A dispenser unit(153) dots the transparent resin including photo conversion material on the LED chip.