| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stack type cooling device which is improved in mountability. <P>SOLUTION: The stack type cooling device 1 is provided with a cooling pipe 62 in a second communication portion 71 which does not have a partition portion 15, an opening end of the cooling pipe 62 is joined with a lower body 63 forming a wall surface, and a first communication portion 61 and the second communication portion 71 are provided with a refrigerant introduction pipe 10 and a refrigerant discharge pipe 50 on the same plane of the stack type cooling device 1. <P>COPYRIGHT: (C)2011,JPO&INPIT |
