发明名称 CIRCUIT MODULE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a circuit module which prevents the separation between a resin sealing body and a circuit pattern part, even if an external temperature changes. <P>SOLUTION: A control circuit package 6 as the circuit module is provided with: two conductive circuit pattern parts 22a and 22b which are provided so as to space; a resistance 30 in which the two circuit pattern part 22a and 22b are connected to each other; a resin sealing body 19 in which the two circuit pattern parts 22a and 22b and the resistance 30 are buried. The pattern parts 22a and 22b is provided with: a connection part 40 which is linearly extended to connect to a pressure welding terminal; a component mounting part 42 in which the resistance 30 is mounted; a narrow-width linking part 43 which is linked to one edge in the width direction of the connection part 40, and is linked to both the connection part 40 and the component mounting part 42. The width of the narrow-width linking part 43 is narrower than both widths of the component mounting section 42 and the connection part 40. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011129645(A) 申请公布日期 2011.06.30
申请号 JP20090285551 申请日期 2009.12.16
申请人 YAZAKI CORP 发明人 WATANABE KENGO
分类号 H01L23/50;H01L23/12;H01R13/66;H05K1/02 主分类号 H01L23/50
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