| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency module that increases coolability and simultaneously make a size of a package small, and a high-frequency module cooling system. SOLUTION: The high-frequency module includes: an input terminal; a high-frequency circuit board at an input side, having a microstrip line of the input side; a semiconductor device amplifying high-frequency signals; a high-frequency circuit board at an output side, having a microstrip line of the output side; a package having a metal part on its bottom face, which surrounds the high-frequency circuit board at the input side, the semiconductor device and the high-frequency circuit board at the output side; and a cover sealing the package. The semiconductor device is arranged such that an arrangement direction of a finger electrode of the semiconductor device has a smaller angle than 90°with respect to an input and output terminal direction which is a direction to a signal output direction parallel to a signal input direction with respect to the package. COPYRIGHT: (C)2011,JPO&INPIT |
