| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that there is a higher possibility of causing a dead pixel, a dropout, and a fall to a part of identification codes when a force is applied from the outside as a ratio (so-called aspect ratio) of a height to a bottom area of a dot when overgrazing the dot in order to improve visibility in the identification code that is marked on the semiconductor device. SOLUTION: In a device and a method of marking an identification code on a semiconductor device, a groove filling material is applied over the identification code or the identification codes are laminated and formed in such a manner as to reduce height differences at the recessed/projected portion of the identification code. Furthermore, the semiconductor device is marked with the identification code. COPYRIGHT: (C)2011,JPO&INPIT |
