| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component that can prevent moisture, such as plating liquid, from penetrating a body and imperfect mounting of the electronic component and an increase in dimensions of a product, and improve reliability of the electronic component, and to provide the electronic component. SOLUTION: The method of manufacturing the electronic component 1 includes: a plated layer forming step S6 of forming a plated layer 17 such that the plated layer 17 covers an entire baking electrode 16a, after the backing electrode 16a is formed; an oxidation heat treatment step S7 of performing heat treatment to the plated layer 17 in an oxygen atmosphere; and a reduction heat treatment step S8 of performing heat treatment to the plated layer 17 in a reduction atmosphere, after the oxidation heat treatment step S7. Thus, elaborated external electrodes can be formed so that the plating liquid is prevented to penetrate. Further, it is possible to make thickness of the backing electrode 16a smaller than those of conventional ones, allowing an outline dimension of the external electrodes 3 and 4 to be made small, so that the occurrence of the imperfect mounting of the electronic component 1 and the increase in the dimensions of the product can be prevented. COPYRIGHT: (C)2011,JPO&INPIT |
