发明名称 Curable Organopolysiloxane Composition and Semiconductor Device
摘要 A curable organopolysiloxane composition comprising: (A) an organopolysiloxane that contains in one molecule at least two alkenyl groups and at least 30 mole % of all silicon-bonded monovalent hydrocarbon groups in the form of aryl groups: (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; (C) a branched-chain organopolysiloxane that contains alkenyl, aryl, and epoxy-containing organic groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.
申请公布号 US2011160410(A1) 申请公布日期 2011.06.30
申请号 US20090997162 申请日期 2009.06.11
申请人 发明人 SAGAWA TAKASHI;TERADA MASAYOSHI;YOSHITAKE MAKOTO
分类号 C08G77/38 主分类号 C08G77/38
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