Electronic component device e.g. infrared sensor device, has ground connection electrically connected to ground connection electrode, and shielding connections connected to shielding sheath and extended to outer surface of housing unit

摘要

The device has an electronic component accommodated in a housing unit and including a hot connection electrode and a ground connection electrode connected to a ground terminal. Hot connections (14, 15) and a ground connection (16) are electrically connected to the hot and ground connection electrodes, respectively, and extend to an outer surface of the housing unit. Shielding connections (13a-13d) are connected to a shielding sheath (13) and extend to the outer surface of the housing unit. The ground connection extends over a lower side of one of side surfaces of the shielding sheath. An independent claim is also included for a line frame for manufacturing an electronic component device comprising a lead frame body.