发明名称 MOLDED ARTICLE WITH LOW PHOTOELASTICITY
摘要 PROBLEM TO BE SOLVED: To provide a molded article with a low photoelastic modulus that is excellent in transparency, thermal resistance and impact resistance. SOLUTION: The molded article includes a resin composition containing as the main component a mixture (X) of an aliphatic polycarbonate resin (A) having a structural unit (a) derived from a dihydroxy compound with a moiety represented by general formula (1) and a structural unit (b) derived from cyclohexane dimethanol and an aromatic polycarbonate resin (B), and has a photoelastic modulus of 7×10<SP>-11</SP>Pa<SP>-1</SP>or lower at a light wavelength of 600 nm. The mixture (X) has a single glass transition temperature, which is as high as or higher than the glass transition temperature of the aliphatic polycarbonate resin (A) and as low as or lower than the glass transition temperature of the aromatic polycarbonate resin (B), (provided that the case where the moiety represented by general formula (1) constitutes a part of -CH<SB>2</SB>-O-H is excluded). COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011127037(A) 申请公布日期 2011.06.30
申请号 JP20090288107 申请日期 2009.12.18
申请人 MITSUBISHI CHEMICALS CORP 发明人 FUJI MICHIAKI;YOKOKI MASASHI;TANAKA KAZUYA;TANIGUCHI KOICHIRO
分类号 C08L69/00;C08J5/00 主分类号 C08L69/00
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