| 摘要 |
PROBLEM TO BE SOLVED: To provide a material which is suitable for a housing of an electronic apparatus or the like and has lightweight properties, mechanical strength, thermal conductivity, electric field shielding properties, conduction and non-electrification properties, self-tapping strength of a screw, and easiness in molding. SOLUTION: A composite resin material used for the housing which stores an electronic apparatus or electronic component includes a PA6 resin [polyamide (6,6-nylon) resin], an ABS resin (acrylonitrile-butadiene-styrene copolymerized resin), and carbon fibers, electric field shielding properties at a 1 GHz band being≥20 dB, and thermal conductivity being≥1.0 W/(m×K). COPYRIGHT: (C)2011,JPO&INPIT |
