| 发明名称 |
CURABLE COMPOSITION HAVING IMPROVED HEAT-RESISTANCE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a curable composition containing a polyoxyalkylene polymer having a crosslinkable silicon group and giving a cured product having excellent high-temperature adhesive strength. <P>SOLUTION: The curable composition includes an oxyalkylene polymer having a crosslinkable silicon group crosslinkable by forming a siloxane bond and having a hydroxyl group or a hydrolyzable group bonded to a silicon atom, colloidal calcium carbonate and at least one kind of oxide selected from the group consisting of calcium oxide and magnesium oxide. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
| 申请公布号 |
JP2011127007(A) |
申请公布日期 |
2011.06.30 |
| 申请号 |
JP20090287285 |
申请日期 |
2009.12.18 |
| 申请人 |
CEMEDINE CO LTD |
发明人 |
OKABE YUSUKE;SAITO ATSUSHI |
| 分类号 |
C08L71/02;C08G65/336;C08K3/22;C08K3/26 |
主分类号 |
C08L71/02 |
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