发明名称 MOUNTING STRUCTURE AND MOUNTING METHOD OF PARTS ON FLEXIBLE PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a part-mounting structure and a method thereof to securely reinforce the component region of a flexible printed circuit board. SOLUTION: A top gold plating layer 122 and solder 140 are laminated in order on the upper surface of an opening of a top coverlay 110 in a region wherein a component 142 is electrically connected to the top surface of a signal line, and further the component is coupled to the solder, further, a bottom gold plating layer 120 is formed on the bottom surface of an opening of a bottom coverlay 100 in a ground region of the component region, and a conductive tape 130 and conductive metal 132 are laminated in order on the bottom surface of the bottom coverlay and bottom gold plating layer in the component region. The conductive tape and conductive metal are laminated to be electrically connected for reinforcement, so the resistance value of a ground part of the flexible printed circuit board is made smaller while solidity of a component mounting surface is maintained. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011129886(A) 申请公布日期 2011.06.30
申请号 JP20100240909 申请日期 2010.10.27
申请人 FLEXCOM INC 发明人 KIM HYEON U
分类号 H05K1/02;H05K3/34 主分类号 H05K1/02
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