| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming composition suitably used for formation of an insulating film which has a low dielectric constant, stable insulation and superior strength, and suppresses disappointing variations in film thickness and characteristics. SOLUTION: In the film forming composition, a polymerizable compound and/or an polymer with which the polymerizable compound partially polymerises are contained in molecules. The polymerizable compound has a partial structure a1 containing an adamantane type cage structure and a polymerizable functional group. The film forming composition further contains an oligo acetylene body which includes a plurality of acetylene system reactive group containing as acetylenic linkage in the molecules as the polymerizable compound, and further contains a hydrogenated body having a structure wherein at least a part of the acetylene system reactive group in the oligo acetylene body is substituted for hydrogen atoms. The molar fraction of the hydrogenated body to the total number of moles of the oligo acetylene body and the hydrogenated body with the polymerizable compound not polymerized is 0.01-10 mol%. COPYRIGHT: (C)2011,JPO&INPIT |
