| 摘要 |
The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer, comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent; and (D) 20 to 60% by volume of a first inorganic filler; and (E) 1 to 40% by volume of at least one of an organic filler (E1), and a second inorganic filler (E2) that is different from the first inorganic filler (D) and has a new Mohs' hardness of 3 or less and, when the filler (E) contains the organic filler (E1), 3 to 40% by volume of the organic filler (E1).
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