发明名称 |
Moisture Curable Adhesive Composition and Method for Installing Hardwood Floors |
摘要 |
An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight percent of a moisture curable polymer system; and 40 to 90 weight percent of additives for modifying physical properties of the composition. The adhesive has a composition such that, when cured, results in an elastomeric film of uniform thickness that exhibits controlled moisture vapor transmission and sound abatement properties. A floor structure and a method for constructing the floor structure using the adhesive composition are also provided.
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申请公布号 |
US2011154772(A1) |
申请公布日期 |
2011.06.30 |
申请号 |
US20100982306 |
申请日期 |
2010.12.30 |
申请人 |
BOSTIK, INC. |
发明人 |
LONTCHAR MICHAEL S.;CHRONISTER MICHAEL A.;RYAN KRISTIN J. |
分类号 |
E04B5/00;B32B7/12;C09J175/04 |
主分类号 |
E04B5/00 |
代理机构 |
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