Multiple integrated circuit die package with thermal performance

摘要

A method of assembling a multi-die package is achieved. A heat spreader is disposed on a printed circuit substrate. At least one integrated circuit die is disposed on a top side of the heat spreader and at least one other integrated circuit die is disposed on a bottom side of the heat spreader wherein the dies are connected to the substrate by wire bonds. Thermal solder balls are electrically connected to solderable pads of the heat spreader through the open holes of the substrate, so as to couple the heat spreader to function as a ground plane. Some of the ground pads of the dies can be bonded onto the heat spreader and the others bonded onto the substrate. Alternatively, all of the dies could only be connected to the substrate by wire bonding, and not connected to the heat spreader.