| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress generation of shaving dust in performing dicing, and to prevent breakage of a substrate during a manufacturing process, in manufacture of a light emitting device, in which a plurality of light emitting element parts mounted with LED elements are formed on a substrate, and the substrate is diced. <P>SOLUTION: In a process of forming a slit 24 crossing a region 22 for forming light emitting element parts on a metal substrate 20, recessed parts 21 for resin reservoirs are formed to cross the slit 24. Then, the slit 24 is filled with an insulating material, the recessed parts 21 are filled with a resin, and they are cured. Thereafter, light emitting element parts are formed in the region 22 for forming light emitting element parts, the metal substrate is cut using one or more light emitting element parts as units to be mounted on a printed board formed with a pattern. <P>COPYRIGHT: (C)2011,JPO&INPIT |
