| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a surface treatment apparatus for a semiconductor substrate that cleans and dries the substrate while preventing a pattern from being collapsed. <P>SOLUTION: A water repelling agent 106 is supplied to the surface of the semiconductor substrate W in order to form a water repellent protective film on the surface of a projection pattern formed on the semiconductor substrate W. Before the water repelling agent is supplied, a liquid chemical 103 with high oxidizing power is supplied or irradiation with UV light is carried out to forcibly oxidize the projection pattern surface. Consequently, the water repellent protective film is easily formed on the projection pattern surface, and the projection pattern is prevented from being collapsed. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
