| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining device which can acquire the positional information on machined lines on a real time at a low cost. <P>SOLUTION: The laser beam machining device includes: a holding part 1 holding the substrate 60 to be machined; a laser irradiation part 11 for emitting laser light L to the thin films 62, 63, 64 in the substrate 60 to be machined; a machining movement part 35 moving at least either of the holding part 1 and the laser irradiation part 11 along a machining progression direction PD: and a data acquisition part 41 acquiring the positional information of the already machined lines 62<SB>T</SB>, 63<SB>S</SB>. The data acquisition part 41 can acquire the positional information of the machined lines 62<SB>T</SB>, 63<SB>S</SB>different from the prescribed machined lines 62<SB>T</SB>, 63<SB>S</SB>in the meanwhile in which the thin films 62, 63, 64 are machined along the prescribed machined lines 62<SB>T</SB>, 63<SB>S</SB>by the laser light L, and beforehand acquires the positional information of the prescribed machined lines 62<SB>T</SB>, 63<SB>S</SB>before the thin films 62, 63, 64 are machined along the prescribed machined lines by the laser light L. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
