发明名称 DIE ATTACHMENT FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a die attachment film capable of preventing cracking during a pickup. SOLUTION: The die attachment film includes a support film having a principal surface and an adhesive layer disposed on the principal surface in contact with the principal surface. A recess is formed on the principal surface, and the adhesive layer is not arranged at the recess. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011129677(A) 申请公布日期 2011.06.30
申请号 JP20090286221 申请日期 2009.12.17
申请人 RENESAS ELECTRONICS CORP 发明人 WATARI HIROSHI
分类号 H01L21/301;H01L21/52;H01L21/683 主分类号 H01L21/301
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