发明名称 HEATING CURING TYPE SILVER PASTE AND CONDUCTIVE FILM FORMED USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide silver paste which shows excellent conductivity even if heating curing is performed at low temperatures. SOLUTION: The heating curing type silver paste comprises: spherical silver powder sintered alone when it is maintained under the temperature condition of 180 to 250°C for 20 minutes to 2 hours; an epoxy resin liquefied in normal temperature; phenol novolak compound as curing agent; and a solvent. The phenol novolak compound accounts for 48% or more to the epoxy equivalent of the epoxy resin in terms of hydroxyl group, and the total amount of the epoxy resin and phenol novolak compound is 0.5 to 2.5 pts.wt. based on the silver powder of 100 pts.wt., and the flake silver powder having the tap density of 4.5 g/cm<SP>3</SP>or more and the specific surface area of 1.0 m<SP>2</SP>/g or lower may be contained if it sinters alone by the heating condition as the whole silver powder. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011129335(A) 申请公布日期 2011.06.30
申请号 JP20090286095 申请日期 2009.12.17
申请人 SUMITOMO METAL MINING CO LTD 发明人 MAKUTA FUJIO
分类号 H01B1/22;H01B1/00;H01B5/14;H05K1/09 主分类号 H01B1/22
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