| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing insulation capability of a separation region from being degraded due to projecting parts when two semiconductor element regions separated by a separation region have the projecting parts projecting toward the separation region on interfaces with the separation region, and to provide a method of manufacturing the same. SOLUTION: In the semiconductor device 10, a first semiconductor element region 11 includes, on an interface with a separation region 20, first flat parts 13 and first projecting parts 15 projecting toward the separation region 20 relative to the first flat parts 13; and a second semiconductor element region 12 includes, on an interface with the separation region 20, second flat parts 14 and second projecting parts 16 projecting toward the separation region 20 relative to the second flat parts 14. The distance W2 between the first projecting part 15 and the second projecting part 16 of which the distance from the first projecting part 15 is set the shortest is larger than a length obtained by subtracting the height h1 of the first projecting part 15 and the height h2 of the second projecting part from the width W1 of the separation region 20 from the first flat part 13 to the second flat part 14. COPYRIGHT: (C)2011,JPO&INPIT
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