发明名称 BONDING METHOD AND METHOD OF MANUFACTURING SEAL TYPE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method that facilitates bonding a member to which a bonding film is transferred and another member while controlling the bonding area between both members, the bonding film facilitating transfer to the surface of the member, and to provide a method of manufacturing a sealing type device capable of efficiently manufacturing a high reliability sealing type device. SOLUTION: A bonding film transfer sheet 10 has a base material 20 and a bonding film formed on the base material. The bonding film transfer sheet 10 is used so that the bonding film is patterned in a predetermined shape by activating and deactivating the adhesion ability in a predetermined area of the bonding film and thereafter the patterned bonding film 3 is transferred to a case 2. The bonding film 3 contains an Si frame having an atom structure containing a siloxane bond, and a leaving group which is bonded to the Si frame. The bonding film 3 expresses adhesion properties by being provided with energy. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011129590(A) 申请公布日期 2011.06.30
申请号 JP20090284437 申请日期 2009.12.15
申请人 SEIKO EPSON CORP 发明人 ITO YOSHIFUMI
分类号 H01L23/02 主分类号 H01L23/02
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