发明名称 SERVER STRUCTURE WITH A REPLACEABLE HEAT-DISSIPATING MODULE
摘要 A server structure with a replaceable heat-dissipating module comprises at least one heat-dissipating module receiving slot and at least one heat-dissipating module. The heat-dissipating module receiving slot is provided in a case and has two lateral walls each provided with a sliding groove. The heat-dissipating module further comprises a heat-dissipating element and two side boards. The two side boards are located at two sides of the heat-dissipating element for engaging with the sliding grooves, respectively, so that the heat-dissipating module receiving slot replaceably receives the heat-dissipating module therein.
申请公布号 US2011157815(A1) 申请公布日期 2011.06.30
申请号 US20090649280 申请日期 2009.12.29
申请人 LANNER ELECTRONIC INC. 发明人 LIN TSE MIN
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
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