发明名称 |
Systems, methods, and apparatuses for hybrid memory |
摘要 |
Embodiments of the invention are generally directed to systems, methods, and apparatuses for hybrid memory. In one embodiment, a hybrid memory may include a package substrate. The hybrid memory may also include a hybrid memory buffer chip attached to the first side of the package substrate. High speed input/output (HSIO) logic supporting a HSIO interface with a processor. The hybrid memory also includes packet processing logic to support a packet processing protocol on the HSIO interface. Additionally, the hybrid memory also has one or more memory tiles that are vertically stacked on the hybrid memory buffer.
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申请公布号 |
US2011161748(A1) |
申请公布日期 |
2011.06.30 |
申请号 |
US20090655590 |
申请日期 |
2009.12.31 |
申请人 |
CASPER BRYAN;MOONEY RANDY;DUNNING DAVE;MANSURI MOZHGAN;JAUSSI JAMES E |
发明人 |
CASPER BRYAN;MOONEY RANDY;DUNNING DAVE;MANSURI MOZHGAN;JAUSSI JAMES E. |
分类号 |
G06F11/00;G01R31/3177;G06F11/10;G06F11/25;G06F12/08;G11C5/02;H03M13/05;H03M13/15 |
主分类号 |
G06F11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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