EMBEDDED CIRCUIT BOARD AND MANUFACTURING THEREOF

摘要

PURPOSE: An on board circuit board and a manufacturing method thereof are provided to dissipate heat generated in chips, by forming a number of via holes in a substrate core part. CONSTITUTION: A plurality of cavities are formed in a first substrate core part(20). A number of chips with different thickness are built in the cavities. A second substrate core part(30) is formed in each cavity. A copper foil layer(40) is formed on the top surface of the first and the second substrate core part. A resin is coated on the copper foil layer. A tape(70) is attached to the bottom surface of the first substrate core part. The tape supports the chips.