| 摘要 |
<p>PURPOSE: A film for a flip chip type semiconductor back surface is provided to be used from the dicing process of a semiconductor wafer to the bonding process of the semiconductor device. CONSTITUTION: In a film for a flip chip type semiconductor back surface, a film(2) for the flip chip type semiconductor backside is formed in the backside of the semiconductor device connected to a target flip-chip. The film comprises a laser marking layer(21) and a wafer adhesive layer(22). The elastic rate of the laser marking layer is over 100MPa. The elastic rate of the wafer adhesive layer is less than 100MPa. A dicing tape(3) comprises a material(31) and an adhesive layer(32) formed on the material.</p> |
