APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To solve such a problem that there are difficulties in manufacturing a semiconductor device since there causes great warpage in a semiconductor wafer by allowing laser to be irradiated onto the semiconductor wafer and by carrying out marking thereon.

SOLUTION: The semiconductor chip 10 with a semiconductor substrate 11 ground to be thinned and a backside thereof bonded to a dicing tape 21 is carried to a chuck 64 from a load 50. The mark is sequentially formed by laser on the backside of the semiconductor substrate 11 in a marking unit 80 after the semiconductor chip 10 is picked up and inspection of the marking substrate surface is carried out in a pre-marking inspection unit 70. The marking is carried out while the semiconductor chip 10 is individually separated, thereby eliminating the occurrence of warpage in the semiconductor substrate 11.

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