| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure for a printed wiring board that can keep the usage of a high temperature conduction insulating material to the minimum necessary while keeping most of the heat dissipation effect. SOLUTION: This is a heat dissipation structure for a printed wiring board that has a wiring layer consisting of a heat generation source and two or more conductive solid patterns prepared through a clearance with a specific width, wherein a high temperature conduction insulating material with electrical insulation properties, e.g., with a thermal conductivity of 1 W/mK or greater is applied to the clearance such that it overlaps the conductive patterns on both sides of the clearance, thus getting in contact with the conductive solid patterns on both sides of the clearance in a bridge-like fashion, or the high temperature conduction insulating material is applied only to the clearance such that it contacts the conductive solid patterns on both sides of the clearance, and it occupies an area less than 80% of the total surface area on the heat generation source side layer of the printed wiring board excluding the area where the component is mounted. COPYRIGHT: (C)2011,JPO&INPIT
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