| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus that enables high-density packaging. SOLUTION: The electronic apparatus includes a substrate 19 on which an electronic component 3 is mounted, a connector 1 mounted on a first surface of the substrate 19 with an insert hole 1c inclined toward the in-plane direction of the substrate 19 and a bottom 1e made closer to the substrate 19 than an entrance 1d of the insert hole 1c, a barrel 7 disposed higher than the position of the entrance 1d of the insert hole 1c of the connector 1 with reference to the first surface of the substrate 19 in a first direction perpendicular to the first surface, and a flexible printed wiring board 2 that is extended from the barrel 7 to the substrate 19 and is inserted from the entrance 1d of the insert hole 1c to the bottom 1e. A distance between the entrance 1d of the insert hole 1c and the closest portion of the barrel 7 to the substrate 19 is shorter than a distance between the entrance 1d of the insert hole 1c and the bottom 1e. COPYRIGHT: (C)2011,JPO&INPIT
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