发明名称 PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board which suppresses or eliminates generation of a dimension error, shape distortion, and deformation of a flying lead arranged to project to a device hole, and to provide a method of manufacturing the same. SOLUTION: The printed wiring board includes a wiring 2, a device hole 4, and the flying lead 3 connected to the wiring 2 and arranged to project to the device hole 4 on a surface of an insulating base 1. The device hole 4 includes first device holes 5 (5a, 5b, 5c) arranged to include at least a tip end of the flying lead 3, and a second device hole 6 having a larger area than the first device holes 5 and arranged to continue at least partially to the first device holes 5. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011129604(A) 申请公布日期 2011.06.30
申请号 JP20090284727 申请日期 2009.12.16
申请人 HITACHI CABLE LTD 发明人 IMAI NOBORU;ISAKA FUMIYA;OMORI TERUYUKI;HOSHI MASAHIRO;FUKUI KAZUKI
分类号 H01L21/60 主分类号 H01L21/60
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