| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition having excellent photosensitive and mechanical properties on a copper wafer substrate surface. <P>SOLUTION: The negative photosensitive resin composition includes 100 pts.mass of (a) a resin soluble in an aqueous alkali solution, 0.1-20 pts.mass of (b) at least one compound selected from the group consisting of nitrogen-containing compounds expressed by imidazole, indazole, triazole and tetrazole, 0.1-20 pts.mass of (c) a compound which generates an acid upon irradiation with actinic rays, and 3-50 pts.mass of (d) a compound capable of crosslinking or polymerizing by the action of an acid. <P>COPYRIGHT: (C)2011,JPO&INPIT |
