| 发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM USING THE SAME AND ELECTRONIC COMPONENT |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a positive photosensitive resin composition showing excellent adhesion to a substrate after curing and excellent storage stability of varnish. <P>SOLUTION: The positive photosensitive resin composition contains (a) a polymer soluble in an alkaline aqueous solution, (b) a compound which generates an acid upon irradiation with light, (c) acetic acid, and (d) a silane coupling agent having a urea bond. <P>COPYRIGHT: (C)2011,JPO&INPIT |
| 申请公布号 |
JP2011128359(A) |
申请公布日期 |
2011.06.30 |
| 申请号 |
JP20090286481 |
申请日期 |
2009.12.17 |
| 申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD |
发明人 |
NAKAMURA YUKI;MATSUYA NORITAKA;OE TADAYUKI |
| 分类号 |
G03F7/023;G03F7/004;G03F7/075;G03F7/40;H01L21/027 |
主分类号 |
G03F7/023 |
| 代理机构 |
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