| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate tray capable of preventing an effect of biting of particles or the like by reducing a contact area between a standard diameter tray and a small diameter substrate. SOLUTION: A semiconductor substrate tray has a groove which is formed at a position where a predetermined small diameter semiconductor substrate of a semiconductor substrate tray body is arranged and which is provided in a cross shape on the semiconductor substrate tray body so that a contact surface to the small diameter semiconductor substrate is formed from an aggregate of a plurality of protruding parts in a grid, a through hole which is formed at the semiconductor substrate tray body to penetrate the groove from a surface opposite to the contact surface for evacuation, first and second columnar positioning pins which are so provided at the semiconductor substrate tray body as to be orthogonal to the contact surface in correspondence to both end positions of the orientation flat of the small diameter semiconductor substrate, and a third columnar positioning pin which is provided at the semiconductor substrate tray body for the three-point contact positioning of the small diameter semiconductor substrate with the first and second positioning pins. COPYRIGHT: (C)2011,JPO&INPIT |
