发明名称 THERMOSETTING ADHESIVE COMPOSITION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thermosetting adhesive composition. <P>SOLUTION: The thermosetting adhesive composition comprises following components (1) to (3): (1) 20-85 wt.% of a polyether (A) having two hydrolyzable alkoxysilane type terminal groups, and having 25 to 40 Pa s of viscosity measured at 23°C and represented by formula (I) (wherein, R<SP>1</SP>and R<SP>2</SP>are each a 1-4C linear or branched alkyl, R<SP>3</SP>is divalent 1-6C alkylene, R<SP>4</SP>is divalent 1-4C linear or branched alkylene, n is an integer making a number average molecular weight Mn of the polymer of formula (I) to be in the range of 20 to 40 kDa, p is an integer of 0, 1 or 2); (2) 15-80 wt.% of a compatible tackifier resin (B) with 200 Da to 10 kDa of number average molecular weight; and (3) 0.01-3 wt.% of a curing catalyst (C). <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011127120(A) 申请公布日期 2011.06.30
申请号 JP20100284359 申请日期 2010.12.21
申请人 BOSTIK SA 发明人 LAFERTE OLIVIER;GOUBARD DAVID
分类号 C09J171/02;C09J5/06;C09J7/02;C09J11/06;C09J11/08;C09J183/08 主分类号 C09J171/02
代理机构 代理人
主权项
地址