| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board capable of preventing occurrence of a crack from the circumference of a connection pad to an inner layer side. <P>SOLUTION: This wiring board includes: an insulation layer 30; a wiring layer 40 embedded in the insulation layer 30; and a connection pad C connected to the wiring layer 40 through a via conductor VC formed in the insulation layer 30 and embedded on an outer surface side of the insulation layer 30; wherein the connection pad C includes a first metal layer 20 (first copper layer) arranged on an outer layer side, an intermediate metal layer 22 (nickel layer) arranged on a surface on an inner layer side of the first metal layer 20, and a second metal layer 24 (second copper layer) arranged on a surface on an inner layer side of the intermediate metal layer 22, and the hardness of the intermediate metal layer 22 is set higher than those of the first metal layer 20 and the second metal layer 24. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
