| 摘要 |
PROBLEM TO BE SOLVED: To provide a coin-shaped electric element capable of being mounted on a substrate by an automatic soldering technique in a soldering reflow method, reducing cost by not using a lead plate, and reducing a mounting area. SOLUTION: The coin-shaped electric element 1 has an outer can 21, a cap 22, and an element body 10. The outer can 21 and the cap 22 seal an inner space by caulking process of an opening edge part of the outer can 21 with a gasket 23 interposed. The coin-shaped electric element 1 has an almost square shape with corner parts of an arc shape in an external appearance in a plan view in the outer can 21. In the coin-shaped electric element, the flat region 21a of the opening edge part 21a in the outer can 21 has a height level in a Z-axis direction of the same or 0.1 [mm] or less in mutual level difference against the exposed part 22a of the cap 22, when the bottom face 21c of the outer can 21 is made a reference. COPYRIGHT: (C)2011,JPO&INPIT |
