| 摘要 |
PROBLEM TO BE SOLVED: To provide a development processing method to improve CD value uniformity on a substrate surface and to shorten processing time, even when exposing and developing a substrate with large kinds of films including an immersion protecting film or a water-repellent resist. SOLUTION: The development processing method develops and processes the substrate while rotating the substrate, after the substrate is coated with a resist on its surface and is exposed. The development processing method includes a developing liquid supply step of moving a developing liquid nozzle 4b disposed over the substrate W from a central side to an outer circumferential side of the substrate W, and to supply the developing liquid D from the developing liquid nozzle 4b onto the substrate W surface, and also includes a first rinse liquid supply step of moving a first rinse liquid nozzle 4c disposed above the substrate W from the central side to the outer circumferential side of the substrate W, and to supply the first rinse liquid R from the first rinse liquid nozzle 4c onto the substrate W surface. The first rinse liquid supply step and the developing liquid supply step are executed simultaneously, while the first rinse liquid nozzle 4c is disposed on an inner side of the substrate W than the developing liquid nozzle 4b. COPYRIGHT: (C)2011,JPO&INPIT |
