| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of diagnosing a fault of a charged particle beam lithography system using a defect inspection device, the method correctly sensing the fault caused in the charged particle beam lithography system in an initial stage. SOLUTION: A substrate is lithographed under three conditions including a normal condition, a safe condition hardly causing a defect, and an acceleration condition easily causing a defect and, after forming a resist pattern, the number of defects is counted with respect to each area using the defect inspection device. An average relation between the inspection sensitivity and the number of defects is obtained with respect to each condition to see if there is any value outside the relation (the number of defects). For example, if there is a defect increasing in the same manner from an average value in both of the area lithographed under the safe condition and the area lithographed under the acceleration condition, it is assumed that the defect depends on the process. On the other hand, defects varying in the number of defects between these areas can be assumed to be caused by the electron beam lithography system. COPYRIGHT: (C)2011,JPO&INPIT
|
