发明名称 LED PACKAGE FOR PLANT GROWTH-PROMOTING
摘要 PURPOSE: A light emitting package for plant growth promotion is provided to reduce establishment areas, production costs and power consumptions by constituting a light emitting chip to the single light emitting package, and by generating and combining a plurality of lights. CONSTITUTION: The light emitting package includes a plurality of light emitting chips(10); an electrode(20); a heat radiation plate; a cylindrical type lens; and a package housing(50). The electrode interlinks the light emitting chip electrically. The lens outputs light emitted from the light emitting chip to outside. In the package housing, the electrode and the light emitting chip are mounted. A hollow(53), in which the lens is fixed to emit light emitted from the light emitting chip to outside, is formed. The package housing includes an upper housing(51) and a lower housing(52). In the upper housing, a hollow and an inner wall(54) surrounding the hollow are formed. The inner wall is formed to be narrow along the inside, and an edge of the inner wall is rounded. One end of the electrode is connected through a line(11) to an anode electrode or a cathode electrode of each light emitting chip, and the other end is extended to outside and arranged to a printed circuit board.
申请公布号 KR20110073826(A) 申请公布日期 2011.06.30
申请号 KR20090130576 申请日期 2009.12.24
申请人 GYEONGGI-DO;ESL LIGHTING CO., LTD.;ISM CO., LTD. 发明人 LEE, SANG WOO;SIM, SANG YOUN;LEE, SU YEON;SEO, MYEONG WHOON;KIM, SOON JAE;LIM, JAE WOOK;PARK, GYEONG YEOL
分类号 A01G7/00;F21V1/02;F21V29/505 主分类号 A01G7/00
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